This job was posted by https://www.azjobconnection.gov : For more information, please see: https://www.azjobconnection.gov/jobs/6456356

The Advanced Electronics and Photonics Core Facility (AEP) is expanding and hiring aProcess Engineer Sr, Packaging. In this period of expansion, AEP is adopting 300 mm, industry-scale wafer processing equipment. The facility is also refreshing its capabilities and broadening equipment offerings to support power electronics and advanced packaging. Using a fee-for-service foundry model, this expansion will further allow AEP to serve the local semiconductor industrys needs by bringing both small- and large-scale, flexible electronics projects to the marketplace.\ \ AEP covers 11,300 square feet of Class 100 (H occupancy), 4,300 square feet of Class 10,000 cleanroom, and 4,600 square feet of wet and dry labs within the MacroTechnology Works building at the Arizona State University (ASU) Research Park. Currently, the facility operates over 80 pieces of major processing equipment (e.g., maskless and projection aligned photolithography, PECVD, sputtering, evaporation, wet etching, dry etching, and more) and characterization tools (e.g., ellipsometry, I-V and I-V-L testers, UV-Vis spectroscopy, FTIR, AFM, profilometry, and more).